Automatic Cure System

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Void Elimination in Film, Die bonding tape, and Epoxy resin.

Benefits & Process Mechanism

Void into resin will be eliminated by using high pressure and high temperature process, especially for fill-in chip processes.

Pressure Void Reduction of OCA Film

Pressure Void Reduction of OCA Film

Specifications

Automatic Cure System ACS-650
Magnet coupling motor type ventilation fan driven system
Stable  temperature uniformity in processing area
Wide process range available for  both pressure and temperature
3-types lineup corresponding to R&D use  to mass production application
Rapid cooling control for fast tact time
Nitrogen gas available

Specifications / Details

Specifications

Following Customizations are available as Options:

Higher Pressure model: 0.1 – 1.0 MPa G
Higher temperature model: RT+10 deg. C – 180 deg. C or 200 deg. C
Booster pumping model: 0.6 MPa for required Pneumatic air
Vacuum model: Pre-evacuation for reducing residual gas