Void Elimination in Film, Die bonding tape, and Epoxy resin.
Benefits & Process Mechanism
Void into resin will be eliminated by using high pressure and high temperature process, especially for fill-in chip processes.
Pressure Void Reduction of OCA Film
Pressure Void Reduction of OCA Film
Specifications
Automatic Cure System ACS-650
- Magnet coupling motor type ventilation fan driven system
- Stable temperature uniformity in processing area
- Wide process range available for both pressure and temperature
- 3-types lineup corresponding to R&D use to mass production application
- Rapid cooling control for fast tact time
- Nitrogen gas available
Specifications / Details
Specifications
Following Customizations are available as Options:
- Higher Pressure model: 0.1 – 1.0 MPa G
- Higher temperature model: RT+10 deg. C – 180 deg. C or 200 deg. C
- Booster pumping model: 0.6 MPa for required Pneumatic air
- Vacuum model: Pre-evacuation for reducing residual gas