This burn-in system subjects semiconductor devices and assembled electronic devices to various thermal and electrical stress, and it is effective for removing semiconductor devices with surface contamination and input circuit deterioration.
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Model Target specimen Temperature range RBS IC, discrete, other general semiconductor devices, various electronic parts, electronic units, and substrates H:+70 to +150°C
M:+20 to +150°C
L:-30 to +150°C
U:-55 to +150°C
- Outside dimensions (mm)
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Model W H D 00 type 780 2050 1250 0 type 780 2050 1530 1 type 1060 2050 1250 2 type 1060 2050 1530 3 type 1060 2050 1250 4 type 1060 2050 1530 7 type 1360 2050 1250 8 type 1360 2050 1530 9 type 1680 2050 1250 10 type 1680 2050 1530 12 type 2300 2050 1250 12 type 2300 2050 1530